SIAE MICROELETTRONICA Outperforms Telef'onica 10Gbps E-band Tests to Power 5G Backhauling
Telef?nica a global leader mobile operator and SIAE MICROELETTRONICA a leader in wireless transport technology have put to the test the high capacity 10Gbps wireless links to enhance the backhauling network for the future advent of 5G.
Telefónica Deutschland Selects SIAE MICROELETTRONICA for Turn-Key DCN Migration Services in Germany
Telef?nica Deutschland, a leading integrated telecommunications provider in Germany awards SIAE MICROELETTRONICA, a long-term strategic partner for wireless transmission solutions, a turn-key contract for DCN (Data Communication Networks) migration services across its backhaul network.
Coriant and SIAE MICROELETTRONICA to Demonstrate SDN-Enabled Multi-Layer Microwave and Millimetre Wave Backhaul Capabilities for 5G Networks
Coriant, a global supplier of open, disruptive, and hyperscale networking solutions, and SIAE MICROELETTRONICA, a leader in wireless communication, today announced a collaboration to demonstrate SDN-enabled Layer3 microwave and millimetre-wave backhaul solutions optimized for the high-capacity, low latency demands of next-generation services and applications, including 5G and IoT.
SIAE MICROELETTRONICA Wins Vodafone Supplier Award
SIAE MICROELETTRONICA today announced that it received the award for `Health and Safety' from Vodafone Group, during the recent 2016 Vodafone annual Supplier Awards ceremony.
RTBF partners with SIAE MICROELETTRONICA for the renewal of its National Microwave Network
RTBF, the public broadcasting organization of the French Community of Belgium, has signed the start of a 3 years renewal project to modernize its microwave network.
EOLO deploys SIAE MICROELETTRONICA microwave technology
EOLO selected the AGS20 and ALFOplus2 solutions to boost its network.
SIAE MICROELETTRONICA joins Nokia partner ecosystem
The company will join the Nokia Networks Microwave Partner Ecosystem as a technology partner for microwave and millimetre wave radio technologies.