IBM develops 3D circuit

IBM has developed a way to build three-dimensional integrated circuits that can increase the amount of computing power on a microchip. The company says its 3D circuits are made by combining separate layers of transistors and connecting them electrically. By doing so, it decreases the length of the wires that connect different parts of the chip, and consequently adds performance.

Putting transistors on top of one another instead of simply side-by-side as in current chips increases the amount of computing power by increasing the density of transistors. Chip maker Intel is also known to be working on 3D circuits and earlier this year announced it had developed a tri-gate transistor, which has three gates rather than one, which is the industry standard. [Reuters]

Microsoft will offer instant messaging software and services geared toward corporations that want to conduct business via quick text messages but also need more control and security.

The announcement of MSN Messenger Connect, the software giant`s paid messaging service, comes a week after Internet services rival America Online launched corporate messaging based on its free AIM messaging service.

Microsoft says its new messaging service will let companies perform transactions with customers, record and log messaging conversations, as well as allow companies to ensure the identity of messaging users. It will be available sometime during the first three months of 2003. [Reuters]

This week in TechNiche:
Sun targets UK schools
Corel introduces free Tablet PC utility