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IBM unveils SOI

By Vicky Burger, ITWeb portals content / relationship manager
Johannesburg, 14 Sept 2007

IBM unveils SOI

To allow mobile chipset providers to reduce component complexity and lower manufacturing costs for next-generation mobile phones, laptops and other portable communication devices, IBM has unveiled CMOS 7RF silicon-on-insulator (SOI) reports Electronics Weekly.

The SOI is a semiconductor manufacturing process aimed at allowing single-chip RF devices through the integration of multiple RF/analogue functions such as multi-mode/multi-band RF switches, complex switch biasing networks, and power controllers.

As this process technology evolves, IBM said it expects it to create additional integration opportunities such as filter, power amplifier, power management and receiver/transmitter functions, which are cost-prohibitive or technically unfeasible with semiconductor technology used in mobile devices today.

Innovation forum at Nortec 2008

The Nortec 2008 11th trade fair for manufacturing technology is, according to Manufacturing Talk, launching a series of innovation forums with up-to-date news of the industry and the latest technologies, presented in a compact format on three days during the fair.

The programme features inter-sectoral and practical trends in development, design, manufacture, measuring technology/QC, logistics, and education and training for young engineers.

There will be discussions on current and future trends with experts from leading companies, professors from universities, and representatives of the trade associations.

Intelligent robots head to manufacturing

Fanuc Robotics America will demonstrate its latest intelligent robotic solutions for assembly, machine tending, packaging, palletising, bin picking, coating and arc welding at its Smart Centre, from 19 to 20 September, says Tooling Online.

The event will feature robot system demonstrations, interactive presentations, and breakout seminars on the company's new LR Mate 200iC LEAN (light, efficient, accurate, nimble) robot and iRVision products including examples of 2D and 3D robotic vision applications.

Attendees will also have the opportunity to meet with automation experts to discuss their own manufacturing challenges.

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