Explaining the Intel Flip-Chip system

Flip-Chip explained: Tarsus` Jason McMillan demystifies Intel technology Intel`s Celeron and Pentium III processors include the mystifying designations of PPGA and FC-PGA respectively. Jason McMillan, product manager for Tarsus PC, produced by Tarsus Technologies and based on Intel processors, explains what these terms mean.

"The Flip Chip Pin Grid Array (FC-PGA) package is used on Pentium III processors, while Plastic Pin Grid Array (PPGA) packaging is used in Celerons," begins McMillan. He points out that this does not mean that Celeron processors have plastic pins - an impossibility since plastic does not conduct electricity.

PPGA processors have the chip`s silicon core facing down towards the motherboard. A heat slug that aids dissipation of heat to the heatsink covers this core. "As the size of the transistors in the processor become smaller - 0.18 micron and below - and faster, the ability to dissipate heat from the processor core becomes more critical," he explains. Because these tiny transistors are used in the Pentium III, the silicon core of the processor is turned over to face up, towards the heatsink. "The core sits on top of the actual package and the silicon die is exposed enabling it to make direct contact with the heatsink and thus run cooler - hence flip chip pin grid array, or FC-PGA," concludes McMillan.