Samsung Electronics has completed development of a 512MB memory module for notebook PCs by applying its high-density packaging technology to load eight 512MB chips in a single package known as a Small Outline Dual Inline Memory Module (SODIMM).
High-density packaging technology, developed exclusively by Samsung, enables a double layer of chips cut from a wafer to be placed in a single package that is the same size as that of packages with a single chip. As a result, the memory capacity is double the 256MB maximum currently available for notebooks, which currently sell at 25% more than their desktop brethren.
Samsung officials predict the SODIMM market will be worth US$70 million this year and skyrocket to US$500 million or more by 2003. The company says it aims to capture between 50% and 70% of this highly lucrative market.
Samsung says it has already shipped samples of the new device to the major notebook PC manufacturers.
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