Samsung goes green with new server module

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The server memory module comes with a 32GB RDIMM (Registered Dual-Inline Memory Module) which is capable of using 30% less power than regular memory modules by utilising 3.5 watts of power per hour.

The process technology is 30nm and the RDIMM is built from 4Gbit DDR3 memory. Samsung says it is 70% faster then prior quad-rank 32GB RDIMMs, transmitting data at up to 1 333Mbit/s and operational speeds of 800Mbit/s, reports The Register.

Typically stacked chips communicate through edge connectors, which widen and lengthen the chips and may require intermediate layers between the memory chip layers. The TSV technology stacks chip layers and sends vertical electrical signals (vias) through the body of the chips using small holes to shorten signal lines and so lessen power consumption.

There is also no need for intermediate layers and the chips are smaller in both width and length.

VR-Zone states that Samsung has not released any details pertaining to global availability of its new 32GB RDIMM DRAM modules, although it has confirmed that engineering samples of the modules have already been released for evaluation purposes, and that it will continue to produce memory modules based off 3D-TSV technology while working to help shrink down the fabrication process to as low as 20nm.