RedLinX Embedded Systems, a value-added distributor of leading edge embedded products and solutions, introduces this exciting new product from VIA Technologies to the South African and the rest of the African market.
The VIA ART-3000, a complete, fanless and ruggedised embedded box system based on the unique I/O-rich Em-ITX form factor, offering the ideal solution for a variety of industrial applications is available from RedLinX Embedded Solutions.
Available as a complete system including drives and memory, the fanless VIA ART-3000 combines a number of unique features, including diskless booting, excellent vibration and shock resistance, dual Gigabit networking and dual LVDS video support.
“Ruthlessly low power consumption means the VIA ART-3000 can also support fanless configurations with no moving parts, making it ideal for ultra stable, mission-critical implementations,” says Wayne Kotze, field engineer at RedLinX Embedded Solutions.
"The VIA ART series really underlines our strength in offering system level products that exceed expectations," said Daniel Wu, Vice-President, VIA Embedded Platform Division, VIA Technologies. "Customers can now take advantage of a complete fanless, ruggedised system that offers incredible flexibility, a wide feature set, and excellent stability straight out of the box."
VIA ART-3000 - wealth of features
The VIA ART-3000 supports up to three displays and two independent video content streams, across dual LVDS and VGA ports. Networking is through dual Gigabit ports, with an array COM and USB ports providing a wealth of device and peripheral connectivity. The VIA ART-3000 supports wall, table, reverse and VESA mounting options and can withstand temperatures of -20^0C-60^0C, vibrations of up to 5Gs and shock resistance up to 20Gs in compact flash storage configurations.
VIA EITX-3000
The VIA EITX-3000 is based on the Em-ITX specification and is suitable for a range of ultra-thin embedded applications. The powerful VIA Nano processor and VIA VX800 media system processor are placed on the reverse of the board, allowing greater space saving for passive cooling and entirely fanless embedded designs. A wide variety of I/O options are provided along dual I/O coastlines and include dual LVDS ports, a VGA port, dual Gigabit Ethernet ports, 6 USB 2.0 ports and four COM ports.
Note: All products are available at RedLinX Embedded Solutions.
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