SIAE MICROELETTRONICASept 11, 2018
Coriant and SIAE MICROELETTRONICA to Demonstrate SDN-Enabled Multi-Layer Microwave and Millimetre Wave Backhaul Capabilities for 5G Networks
Coriant, a global supplier of open, disruptive, and hyperscale networking solutions, and SIAE MICROELETTRONICA, a leader in wireless communication, today announced a collaboration to demonstrate SDN-enabled Layer3 microwave and millimetre-wave backhaul solutions optimized for the high-capacity, low latency demands of next-generation services and applications, including 5G and IoT.